| Xinchenger Electronics Co.,Ltd |
| Seq |
Item |
capability |
| 1 |
Base Material |
FR-4,Rogers ,Arlon,F4B,Taconic,Teflon etc |
| 2 |
Layers |
1-40 ( ≥30 layers needs review ) |
| 3 |
Finished inner/outer copper thickness |
0.5-6OZ |
| 4 |
Finished board thickness |
0.2-7.0mm(≤0.2mm needs review),≤0.4mm for HASL |
Board thickness≤1.0mm: +/-0.1mm
1<Board thickness≤2.0mm: +/-10%
Board thickness>2.0mm: +/-8% |
| 5 |
Max panel size |
≤2sidesPCB: 600*1500mm
Multilayer PCB: 500*1200mm |
| 6 |
Min conductor line width/spacing |
Inner layers: ≥3/3mil
Outer layers: ≥3.5/3.5mil |
| 7 |
Min hole size |
Mechanical hole: 0.15mm
Laser hole: 0.1mm |
Drilling precision: first drilling First drilling: 1mil
Second drilling: 4mil |
| 8 |
Warpage |
Board thickness≤0.79mm: β≤1.0%
0.80≤Board thickness≤2.4mm: β≤0.7%
Board thickness≥2.5mm: β≤0.5% |
| 9 |
Controlled Impedance |
+/- 5 % Ω(<50Ω),+/-10%(≥50Ω),≥50Ω+/-5% (needs review) |
| 10 |
Aspect Ratio |
15:01 |
| 11 |
Min welding ring |
4mil |
| 12 |
Min solder mask bridge |
≥0.08mm |
| 13 |
Plugging vias capability |
0.2-0.8mm |
| 14 |
Hole tolerance |
PTH: +/-3mil
NPTH: +/-2mil |
| 15 |
Outline profile |
Rout/ V-cut/ Bridge/ Stamp hole |
| 16 |
Solder mask color |
Green,yellow,black,blue,red,white,matte green |
| 17 |
Component mark color |
white,yellow,black |
| 18 |
Surface treatment |
OSP: 0.2-0.5um
HASL: 2-40um
Lead free HASL: 2-40um
ENIG: Au 1-10U’’
ENEPIG: PB 2-5U’’/ Au 1-8U’’
Immersion Tin:0.8-1.5um
Immersion silver: 0.1-1.2um
Peelable blue mask
Carbon ink
Gold plating: Au 1-150U’’ |
| 19 |
E-Test |
Flying probe tester : 0.4-6.0mm,max 19.6*23.5inch |
| Min spacing from test pad to board edge : 0.5 mm |
| Min conductive resistance : 5 Ω |
| Max insulation resistance : 250 MΩ |
| Max test voltage : 500 V |
| Min test pad diameter : 6 mil |
| Min test pad to pad spacing : 10 mil |
| Max test current : 200 MA |
| 20 |
AOI |
Orbotech SK-75 AOI : 0.05-6.0mm,max 23.5*23.5inch |
| Orbotech Ves machine : 0.05-6.0mm,max 23.5*23.5inch |
